1. 2. 3. material content data sheet sales product name tlf50251el issued 28. august 2013 ma# MA001056006 package pg-ssop-14-3 weight* 82.98 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 1.797 2.17 2.17 21662 21662 leadframe inorganic material phosphorus 7723-14-0 0.009 0.01 104 non noble metal zinc 7440-66-6 0.034 0.04 415 non noble metal iron 7439-89-6 0.689 0.83 8304 non noble metal copper 7440-50-8 27.978 33.72 34.60 337162 345985 wire noble metal gold 7440-57-5 0.168 0.20 0.20 2029 2029 encapsulation organic material carbon black 1333-86-4 0.100 0.12 1203 plastics epoxy resin - 4.591 5.53 55331 inorganic material silicondioxide 60676-86-0 45.215 54.48 60.13 544885 601419 leadfinish non noble metal tin 7440-31-5 0.976 1.18 1.18 11763 11763 plating noble metal silver 7440-22-4 0.768 0.93 0.93 9251 9251 glue plastics epoxy resin - 0.164 0.20 1973 noble metal silver 7440-22-4 0.491 0.59 0.79 5918 7891 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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